Boto ea Potoloho e thata ea PCB
| Odara Qty. | Tlhahiso e ngata | Tlhahiso ea mohlala | |
| Palo ea lera | 2 ~ 32L | 48L | |
| Max.Botenya ba PCB | 12mm (472mil) | 12mm (472mil) | |
| Min.Bophara/Sebaka | Lera le ka hare | 2.5mil/2.5mil | 2.2mil/2.2mil |
| Lera le kantle | 3mil/3mil | 2.8mil/2.8mil | |
| Max.Botenya ba Koporo | 6Oz | 30Oz | |
| Min.Drill Hole Diameter | Sekoti sa mochini | 0.15mm (6mil) | 0.1mm (4mil) |
| Sekoti sa laser | 0.1mm (4mil) | 0.075mm (3mil) | |
| Max.Boholo (Boemo ba ho Qetela) | Mekhahlelo e le 'ngoe&Habeli | 1150mmX500mm | 1250mmX550mm |
| Multilayer | / | 1250mmX570mm | |
| Aspect Ratio (Finish Hole) | 10:01:00 | 16:01:00 | |
| Lintho tse bonahalang | FR4 | S1000-2, IT180A, IT158, S1000 / S1155, KB6167 | |
| Maqhubu a Phahameng | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, Ro5880 | ||
| Ba bang | Alu.-based, Cu-based etc. | ||
| Surface Finish | HASL, ENIG, Tin ea ho qoelisoa, OSP, silevera ea ho qoelisoa,Electroplating Khauta e Thata / Khauta e Bonolo, Monoana oa Khauta, Khetho ea OSP, ENEPIG. | ||
| HeavyCopperPCB | Max.Botenya ba Koporo | 6Oz | 30Oz |
| HDI PCB | Sebopeho | Lera lefe kapa lefe(10L) | Lera lefe kapa lefe(10L) |
| Bophara/Sebaka (Lera le ka Ntle) | 2.5mil/2.5mil | 2mil/2mil | |
| Aspect Ratio(Blind Hole) | 1:01:00AM | 1:01:00 | |