tenyetsehang pcb 6 Lera fpc Flexible-Rigid PCB tlhahiso Flex PCB Cable (FPC) Rigid-Flexible pcba kopano
TLHALOSO YA SEHLAHLWA:
Boitsebiso ba Motheo: | FR4&PI | Surface Finish: | ENIG |
Botenya ba PCB: | 1.6 limilimithara | Mask oa solder: | Botala/Bosehla |
PCB boholo: | 90*110mm | Silkscreen: | Bosoeu |
Palo ea Lera: | 6/L | Cu Botenya | 35um(1oz) |
PHILIFAST e hlahisa li-PCB bakeng sa bareki ba rona ba sebetsang khafetsa ho tloha ho lihlahisoa tsa LED ho isa lisebelisoa tsa puisano le liindasteri tse fapaneng joalo ka lisebelisoa tsa Bongaka ho ea ho likoloi, sefofane le Bluetooth joalo-joalo.
Sehlahisoa sa mantlha:
Tšebeliso ea FPC:
1. Khamera, khamera ea digital, DV
2. Printer, mochini oa fax, scanner
3. Laptop, LCD skrine, CD-ROM drive, hard disk, HDD
4. Hlooho ea ho rekota, lefatla la laser, VCD, DVD
5 Koloi, DVD ea koloi, meter ea likoloi, GPS
6. Sepakapaka, sathelaete
7. Thepa ea bongaka
8. Lisebelisoa
Tšebeliso ea FPC:
1,PCBBoqapi(1-32L PCB,FR-4, Alu-base PCB, TEFLON, Rogers,HDI PCB)
2,PCB e feto-fetohang, Rigid-Flex PCB.
3,Kopano ea PCB (SMT, BGA, DIP)
4, Ho fumana likarolo
5,Lenaneo la IC le nang le faele ea HEX.
6,Tlhahlobo ea ho qetela ea Ts'ebetso.
7,Kopi ea PCB le PCBA/CloneTshebeletso.
8,Khokahano ea PCB
9,Setšoantšo sa PCB
10,Qetella sehlahisoakopanyay
FPC&Flex-Rigid Circuit Board:
NO. | Ntho | Mohlala | Tlhahiso ka 'Misa |
1 | Layer Count | Flex Board: 1-6 L, Flex-Rigid Board: 2-12 L | Flex Board: 1-6 L, Flex-Rigid Board: 2-12 L |
2 | Boholo ba Panel | ≤500X500mm | ≤500X500mm |
3 | Mofuta oa Boitsebiso ba Motheo | FR-4,Pl,,CCL,PET, PEN | FR-4,Pl,,CCL,PET, PEN |
4 | Max Board Botenya | Flex Board≤2.0mm, Flex-Rigid Board≤4.0mm | Flex Board≤2.0mm, Flex-Rigid Board≤3.0mm |
5 | Min Board Botenya | Flex Board≥0.05mm, Flex-Rigid Board≥0.3mm | Flex Board≥0.05mm, Flex-Rigid Board≥0.4mm |
6 | Min Line Width | ≥ 0.05mm(2mil) | ≥0.075mm(3mil) |
7 | Sebaka sa Min Line | ≥ 0.064mm(2.5mil) | ≥0.075mm(3mil) |
8 | Min Ka lesoba | 0.15mm(6mil) | 0.15mm(6mil) |
9 | Min Blind hole | 0.1mm(4mil) | 0.1mm(4mil) |
10 | Hole ea Min Buried Hole | 0.2mm(8mil) | 0.2mm(8mil) |
11 | Min Plated Hole Botenya | 20µm(0.8mil) | 20µm(0.8mil) |
12 | Ho roala ka holim'a metsi | HASL,ENIG, OSP,ENIG+OSP | HASL,ENIG, OSP,ENIG+OSP |
13 | 'Mala oa mask oa solder | Botala, Boputsoa, Botsho, Bosoeu, Bosehla, Bokhubelu | Botala, Boputsoa, Botsho, Bosoeu, Bosehla, Bokhubelu |
14 | 'Mala oa silika | Bosoeu, Botsho, Bokhubelu | Bosoeu, Botsho, Bokhubelu |
15 | Koporo e teteaneng | 1/3oz - 2oz (12-70µm) | 1/3oz - 2oz (12-70µm) |
16 | PTH Dia Tolerance | ±0.076mm(±3mil) | ±0.076mm(±3mil) |
17 | NPTH Dia Mamello | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
18 | Hlalosa Mamello | ±0.15mm (±6mil) | ±0.15mm (±6mil) |
19 | Teko ea Voltage | 50-330V | 50-330V |
20 | Ntho e 'ngoe ea Tlhahlobo | IPC-6012 / A-600H | IPC-6012 / A-600H |
PHILIFAST hlahisa le ho bokana PCBs e le ka ho ya ka difaele moreki moralo, ha re meralo pcb ka boeona.Haeba u na le lipotso, ka kopo, romella moralo oa hau ho rona bakeng sa quote.re tla ba morekisi oa hau ea hloahloa oa EMS.