High Quality Turnkey FPC OEM/ODM Electronics Manufacturer PI Reinforcement Flexible Board FPC Assembly For Medical Device
TLHALOSO YA SEHLAHLWA:
| Boitsebiso ba Motheo: | PI | Surface Finish: | HASL |
| Botenya ba PCB: | 0.3 limilimithara | Mask oa solder: | Bosehla |
| PCB boholo: | 60* 72mm | Silkscreen: | Bosoeu |
| Palo ea Lera: | 2/ L | Cu Botenya | 35um (1oz) |
PHILIFAST Tsepamisa maikutlo ho moetsi oa fpc OEM le tšebeletso ea kopano ka lilemo tse ngata, o ka fumana li-prototypes tsa pcb tse feto-fetohang tse tsoang fekthering ea rona.Sehlopha sa rona sa litsebi tsa moenjiniere se tla fana ka tharollo e molemohali ea ho ntlafatsa tlhahiso ea hau ea liboto tsa PCB.
Tšebeliso ea FPC:
1. Khamera, khamera ea digital, DV
2. Printer, mochini oa fax, scanner
3. Laptop, LCD skrine, CD- ROM drive, hard disk, HDD
4. Recorderhead, laser bald, VCD, DVD
5 Koloi, DVD ea koloi, meter ea likoloi, GPS
6. Sepakapaka, sathelaete
7. Thepa ea bongaka
8. Lisebelisoa
9. Khamera ea digital / CCTV kamera / Drones / Sesebelisoa sa Lehae
10. Koloi ea elektronike / Toy bakeng sa Bana
Tsebo e ikhethang ea FPC:
1. Boholo bo bonyenyane, kopanyo e phahameng ea methapo
2. Boloka sebaka
3. Nolofatsa mokhoa oa ho hlophisa le ho nolofatsa likhoele.
4. Boloka litšenyehelo tsa lisebelisoa tsa batho
5. ka ho feto-fetoha ha maemo le ho phuthoa habonolo le ka bolokolohi.
Sehlahisoa sa mantlha:
Ke eng hape eo re ka u etsetsang eona:
1, Tšebeletso ea Tlhahiso ea PCB.(FR- 4, HI- TG, Aluminium, FPC,TEFLON, Rogers, CEM-1)
2, FPC, Rigid- Flex PCB.
3, Tšebeletso ea Kopano ea PCB.(SMT, BGA, DIP)
4, lenaneo la IC le nang le faele ea HEX.
5, tšebeletso ea kopano ea matlo ea PCBA.
6, Tlhahlobo ea ho Qetela ea Ts'ebetso ea PCBA.
7, PCB & PCBA Copy Service.
8, Theko ea Lisebelisoa tsa Elektronike & Litšebeletso tsa Theko ea Lethathamo la BOM
9, Stencil ea PCB SMT.(Laser cut & etching)
10, kopano ea cable
FPC&Flex-Rigid Circuit Board:
| Mofuta oa taelo | Tlhahiso e ngata | Tlhahiso ea mohlala | |
| Lira tse Rigid-Flex | 10 Lera | 10 Lera | |
| Lira tse Rigid-Flex | Flexible Layer | 18 Lera | 20 Lera |
| Kakaretso ea Lera | 22 Lera | 24 Lera | |
| Min.Botenya ba koporo ba FCCL (um) | 12um | 2 um | |
| Min.botenya (mm) | FPC ea mahlakoreng a mabeli | 0.11 limilimithara | 0.11 limilimithara |
| Likarolo tse 4 tse Rigid-flex | 0.26 limilimithara | 0.26 limilimithara | |
| Sepakapaka sa bophara ba mola(um) | Ka hare (Hoz) | 65/65 | 50/60 |
| Lera le ka ntle (Hoz+platting) | 75/75 | 65/75 | |
| Min.Boholo ba lesoba(mm) | Min Mechanical Drill | 0.1 limilimithara | 0.05 limilimithara |
| Ho cheka ka Laser | 0.1 limilimithara | 0.075 limilimithara | |
| Taolo ea impedance | ±10% | ±8% | |
| Mamello ea tsela ea FPC (mm) | ±0.1 | ±0.05 | |
| Mask ea solder | Botala, Bosehla, Bosweu, Botsho... | ||
| Silk Screen | Bosoeu , Botsho , Bosehla... | ||
| HDI | 2+C+2 | ||
| Sebopeho | Buka, Air Gap, Fly- tail, Unsymmetrical, Semi- flex | ||
| Lintho tse bonahalang | Polymide(PI), PET,FR-4, Halogen-free, Halogen(Lead free) | ||
| Koporo e boima e Rigid- Flex | M(2oz) | ||
Re hlahisa le ho bokana PCBs e le ka ho ya ka difaele moreki moralo, ha re meralo pcb ka boeona.Haeba u na le lipotso, ka kopo, romella moralo oa hau ho rona bakeng sa quote.re tla ba morekisi oa hau ea hloahloa oa EMS.
